thermal dissipation

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• Thermal grease — From left to right: Arctic Cooling MX 2 and MX 3, Tuniq TX 3, Cool Laboratory Liquid Metal Pro( Liquid Metal based), Shin Etsu MicroSi G751, Arctic Silver 5, Powdered Diamond. In background Arctic Silver grease remover …   Wikipedia

• Thermal pad (computing) — In computing and electronics, thermal pads are commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or… …   Wikipedia

• Thermal runaway — refers to a situation where an increase in temperature changes the conditions in a way that causes a further increase in temperature leading to a destructive result. It is a kind of positive feedback.Chemical engineeringIn chemical engineering,… …   Wikipedia

• Thermal resistance in electronics — Thermal resistance is the temperature difference across a structure when a unit of heat energy flows through it in unit time. It is the reciprocal of thermal conductance. The SI units of thermal resistance are kelvins per watt, or the equivalent… …   Wikipedia

• Thermal laser stimulation — represents a class of defect imaging techniques which employ a laser to produce a thermal variation in a semiconductor device. [Harvnb|Beaudoin|Desplats|Perdue|Boit|2004] This technique may be used for semiconductor failure analysis. There are… …   Wikipedia

• Thermal Design Point — Thermal Design Power Le TDP (Thermal Design Power en anglais) d’un semi conducteur est l’enveloppe thermique de celui ci, il est exprimé en watts. Le TDP renseigne sur la consommation électrique et la chaleur à dissiper/évacuer d’un semi… …   Wikipédia en Français

• Thermal Design Power — Le TDP (Thermal Design Power en anglais) d’un semi conducteur est l’enveloppe thermique de celui ci, il est exprimé en watts. Le TDP renseigne sur la consommation électrique et la chaleur à dissiper/évacuer d’un semi conducteur, utiles aux… …   Wikipédia en Français

• Thermal management of electronic devices and systems — Heat generated by electronic devices and circuitry must be dissipated to improve reliability and prevent premature failure. Techniques for heat dissipation can include heatsinks and fans for air cooling, and other forms of computer cooling such… …   Wikipedia

• Thermal management of high power LED — With the coming of energy saving era, high power light emitting diodes (LEDs) are promising to replace other technologies such as incandescent and fluorescent bulbs in signaling, solid state lighting, and vehicle headlight applications due to… …   Wikipedia

• Dissipation — In physics, dissipation embodies the concept of a dynamical system where important mechanical models, such as waves or oscillations, lose[citation needed] energy over time, typically from friction or turbulence. The lost energy converts into heat …   Wikipedia

• Thermal Design Power — Mit Thermal Design Power (Abkürzung: TDP, gelegentlich auch falsch: Thermal Design Point) wird in der Elektronikindustrie ein maximaler Wert für die thermische Verlustleistung eines Prozessors oder anderer elektronischer Bauteile bezeichnet, auf… …   Deutsch Wikipedia